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PCD Die Blank for Wire Drawing
TSD SERIES
TSD SERIES

Category:PCD Die Blank for Wire Drawing

Characteristics:PCD die blanks are produced by advanced HTHP process. High degree of diamond-to-diamond assures they combine the hardness, abrasion resistance and high thermal conductivity of natural diamond with a toughness approaching that of tungsten carbide. They are better choice for high precision and long life wire drawing dies. Our PCD divided into BCD series and TSP series.

TSD SERIES
TSD series is newly developed PCD diamond blanks(TSD), it is an unsupported polycrystalline diamond composite. And it has been made thermally stable more 1,000°C. This is important when mounting the die bland wiht high temperature brazing alloy or deawing wire in a high remperature condition.
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