PLM(Poly-like micron diamond) - Polycrystalline Diamond

Characteristics:

★ Excellent self-sharpening ability, continuously generate new edges during interacting with the workpiece.
★ Less lapping pressure needed during work.
★ Less residual debris left on the workpiece.
★ Without limit of large sizes and volume quantity supply.
★ Lower cost.

Applications:

★ Neutral and clean, suitable for producing polishing slurry and other liquid polishing products.
★ Mainly used for fine lapping and polishing on semiconductor industry ( sapphire, Si, SiC, GaN), electronic and IT industries, etc.
★ Also recommended for fast grinding and high request on the surface roughness on hard & brittle materials.

Testing results shows that PLM outperforms monocrystalline diamond and polycrystalline diamond on polishing sapphire and SiC, it makes a outstanding balance of materials removal rate and surface quality.

Compared with monocrystalline diamond and polycrystalline diamond, PLM has more cutting points in the surface.

Size:
1-2、1-3、2-4、3-5、3-6、4-6、4-8、5-10、6-12、8-16、10-20、12-22、15-25、20-30、30-40、40-60

Product：	PLM(Poly-like micron diamond)
Name：
Message：
E-mail：
Company Name：